CMES | CMC | MCB | SID | MLPG I | MLPG II | EDEM
| ICCES'05 | Publisher |
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| Proceedings of the 2004 International Conference
on Computational & Experimental Engineering & Sciences Chapter 13 | ||
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Manufacturing Process Modeling
Organizers: Dr. Frederick W. Brust, Professor Wen-Hwa Chen, & Professor Hidekazu Murakawa |
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Identification of Equivalent Material Constants of a Printed Circuit Board
Kun-Nan Chen; Hsien-Chie Cheng |
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Optimal Thermal Design for Chip Placement in Multichip Modules
Wen-hwa Chen; Hsien-Chie Cheng |
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Determination of Residual Stress in GTA Multi-pass Welds in Stainless Steel Pipe by Means of Numerical Simulation and Comparison with Experimental Measurement
Dean Deng; Hidekazu Murakawa |
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Prediction of Welding Distortion Using Eigen Strain
Hidekazu Murakawa |
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Virtual Reality Technology in Civil Engineering: The Wall's Construction Model
Almeida Zita Sampaio; Pedro Gameiro Henriques; Pedro Studer Ferreira |
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